Photos Of Steel Housing Huawei Ascend P8 Leaked – Androidics

From the French website nowhereelse.fr are some pictures leaked of the steel casing of the upcoming Huawei Ascend P8. On the pictures you can see that the Ascend P8 like its predecessors, will again be very thin

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It is expected Huawei Ascend P8 will at CES in Las Vegas already shown. According to rumors the smartphone will include will include a 5.2-inch display with a resolution of 1080p and a Hisilicon Kirin 930 octa-core chipset. Sitting in the thin case include holes for a SIM card, a microSK card and LED flash.

There are still relatively few data are available on the Huawei Ascend P8, which appears to indicate that the smartphone may still not be announced in January at CES, but only during the MWC in March.

via [allaboutbusiness phones]